| 摘要 |
An image sensor includes a substrate, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate consists of a middle board and a plurality of spaced, symmetrical metal sheets arranged at two sides of the middle board. Each metal sheet includes a first board and a second board positioned at different heights. The horizontal height of the middle board is lower than that of the first board. The frame layer encapsulates the metal sheets and the middle board with the first boards, second boards and middle board of the metal sheets exposed from the frame layer. The second board is electrically connected to the printed circuit board. The photosensitive chip is positioned on the middle board of the substrate. The wires electrically connect the first boards to the photosensitive chip. The transparent layer is positioned on the frame layer to cover the photosensitive chip.
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