Optocoupler and its manufacturing method

摘要

The present invention realizes easy packaging of an optical module without using a molding machine and metal mold. <??>The optical module has a PD platform and an LE platform in a package box. A recess is formed at the top of one sidewall of the package box on the side from which a ferrule projects. Further, adhesive is used to fill the gap between the recess and ferrule. The adhesive is further applied on the part of the ferrule near the recess. The internal space of the package box accommodating the platforms is filled with thermosetting resin, after which the thermosetting resin is cured. Thus, the whole platform body is finally encapsulated with the resin. The applied adhesive prevents the thermosetting resin from flowing to the outside. <IMAGE>