Apparatus for packaging electronic components

摘要

Device for packaging electronic components comprises an assembly frame (1) holding and enclosing a plastic intermediate support (2). The support has a number of conducting pathways connected by contacts. The pathways lead to a number of semiconductor chip positions (4) within the frame and have semiconductor chips (5) in these positions with contact surfaces connected to the conducting pathways. Preferred Features: Plastic distance spacers hold the chips on the support in the semiconductor chip position. A plastic lattice (6) is also arranged on the support. A cast plastic composition (7) is provided between the chips and the lattice when packaging a number of chips. An Independent claim is also included for a process for the packaging electronic components.