Disclosed is a technique for increasing the shelf life of devices, such as OLED which requires hermetic sealing from moisture and oxygen with out increasing the bonding width. In one embodiment, the permeation path of moisture or oxygen is increased without increasing the bonding width. This is achieved by using a grooved interface between the cap and substrate on which the components of the device are formed. The grooved interface can comprise various geometric shapes.
申请公布号
EP1430551(A1)
申请公布日期
2004.06.23
申请号
EP20020777185
申请日期
2002.09.24
申请人
OSRAM OPTO SEMICONDUCTORS GMBH;INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING
发明人
LOW, HONG, YEE;GUENTHER, EWALD, KARL, MICHAEL;CHUA, SOO, JIN