POSITIVE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION

摘要

The invention provides a positive photosensitive resin composition which is free from film reduction, swelling or peeling at the time of development with an aqueous alkaline solution and which provides a dimensionally stable patterns after curing, and of which the final cured film has a low water absorption and excellent alkaline resistance. A positive photosensitive polyimide resin composition characterized by comprising an organic solvent-soluble polyimide having repeating units represented by the formula (1): <CHEM> (wherein m is an integer of from 3 to 10,000, R<1> is a tetravalent organic group, R<2> is a bivalent organic group, provided that from 5 to 100 mol% of R<2> is a bivalent organic group having fluorine), a polyamic acid and a compound capable of generating an acid by irradiation with light.