发明名称 |
PROCESS CHAMBER OF RAPID THERMAL PROCESSING(RTP) APPARATUS |
摘要 |
PURPOSE: A process chamber of an RTP(Rapid Thermal Processing) apparatus is provided to smoothly carry out RTP by improving the coupling structure between an edge ring and a circular cylinder using a concave and convex portion. CONSTITUTION: A process chamber of an RTP apparatus includes an edge ring(403). The edge ring has a loading portion(403a) at the center portion for loading a wafer(406) and a plurality of grooves(403b) at the edge portion. The process chamber further includes a circular cylinder(405) at the lower portion of the edge ring. The circular cylinder has a plurality of protrusions(405a) corresponding to the grooves. A spin substrate(402) is used for rotating the edge ring and the circular cylinder. A plurality of lift pins are installed in the spin substrate.
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申请公布号 |
KR20040052375(A) |
申请公布日期 |
2004.06.23 |
申请号 |
KR20020080246 |
申请日期 |
2002.12.16 |
申请人 |
DONGBU ELECTRONICS CO., LTD. |
发明人 |
LEE, MU HYEONG |
分类号 |
H01L21/324;(IPC1-7):H01L21/324 |
主分类号 |
H01L21/324 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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