发明名称 PROCESS CHAMBER OF RAPID THERMAL PROCESSING(RTP) APPARATUS
摘要 PURPOSE: A process chamber of an RTP(Rapid Thermal Processing) apparatus is provided to smoothly carry out RTP by improving the coupling structure between an edge ring and a circular cylinder using a concave and convex portion. CONSTITUTION: A process chamber of an RTP apparatus includes an edge ring(403). The edge ring has a loading portion(403a) at the center portion for loading a wafer(406) and a plurality of grooves(403b) at the edge portion. The process chamber further includes a circular cylinder(405) at the lower portion of the edge ring. The circular cylinder has a plurality of protrusions(405a) corresponding to the grooves. A spin substrate(402) is used for rotating the edge ring and the circular cylinder. A plurality of lift pins are installed in the spin substrate.
申请公布号 KR20040052375(A) 申请公布日期 2004.06.23
申请号 KR20020080246 申请日期 2002.12.16
申请人 DONGBU ELECTRONICS CO., LTD. 发明人 LEE, MU HYEONG
分类号 H01L21/324;(IPC1-7):H01L21/324 主分类号 H01L21/324
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