POLISHING HEAD AND SEMICONDUCTOR WAFER END FACE POLISHING MACHINE

摘要

An object of this invention is to provide a polisher and a polishing head for polishing the end surface of a semiconductor wafer easily and to make it easier to replace its tool for the polishing. A polishing head 30 comprises a driver roller 33, a driving means 36 for rotating this driver roller, a pair of upper and lower follower rollers 34, 35 one above the other parallel to and horizontally separated from the driver roller, and an endless polishing belt B around the driver roller and the follower rollers. A pair of upper and lower tension-controlling rollers 41, 42 are provided for controlling the tension in the polishing belt between the tow follower rollers. At least one of these tension-controlling rollers is movable vertically <IMAGE>