Manufacturing method for electronic component module and electromagnetically readable data carrier

摘要

A semiconductor bear chip (9) having a bump (10) subjected to high temperatures is pressed, from the upper side, onto a wiring board (8) including a wiring pattern, a thermosetting resin film (4) covering an electrode area on the wiring pattern and having insulating particles dispersed and included and a thermoplastic resin film (7) covering the thermosetting resin film (4), while applying a ultrasonic wave, thereby inserting the bumps (10) of the semiconductor bear chip (9) through the thermoplastic resin film and the thermosetting resin film to bond the top end portion of the bump (10) with the electrode area.