发明名称 PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREFOR
摘要 A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party pad 81. The joining pin is constructed by a joining head portion 11 greater than an opening diameter of the through hole and forming a joining portion to the opposite party pad, and a leg portion 12 having a size capable of inserting this leg portion into the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering material 20, etc. A joining ball approximately having a spherical shape instead of the joining pin can be also joined to the through hole by the conductive material. <IMAGE>
申请公布号 EP0959648(A4) 申请公布日期 2004.06.23
申请号 EP19980900160 申请日期 1998.01.05
申请人 IBIDEN CO., LTD. 发明人 ISHIDA, NAOTO;ASANO, KOUJI
分类号 H05K1/11;H01L23/12;H01L23/498;H01R12/00;H05K1/14;H05K3/30;H05K3/34;H05K3/36;H05K3/46 主分类号 H05K1/11
代理机构 代理人
主权项
地址