发明名称 |
PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREFOR |
摘要 |
A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party pad 81. The joining pin is constructed by a joining head portion 11 greater than an opening diameter of the through hole and forming a joining portion to the opposite party pad, and a leg portion 12 having a size capable of inserting this leg portion into the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering material 20, etc. A joining ball approximately having a spherical shape instead of the joining pin can be also joined to the through hole by the conductive material. <IMAGE> |
申请公布号 |
EP0959648(A4) |
申请公布日期 |
2004.06.23 |
申请号 |
EP19980900160 |
申请日期 |
1998.01.05 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
ISHIDA, NAOTO;ASANO, KOUJI |
分类号 |
H05K1/11;H01L23/12;H01L23/498;H01R12/00;H05K1/14;H05K3/30;H05K3/34;H05K3/36;H05K3/46 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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