发明名称 |
Pressure contact power semiconductor relay |
摘要 |
<p>The relay has a ceramic substrate (10) with a structured metallised layer fitted with semiconductor elements, a 2-part housing (22,24) having openings (240) for fixing to a heat sink base, power and auxiliary connection elements (34,36) and a control device (50) fitted to the outside of the housing. The connection elements have spring sections and are received and fixed in openings and recesses provided by the cooperating housing parts upon snap-fitting them together.</p> |
申请公布号 |
EP1381115(B1) |
申请公布日期 |
2004.06.23 |
申请号 |
EP20030011570 |
申请日期 |
2003.05.22 |
申请人 |
SEMIKRON ELEKTRONIK GMBHPATENTABTEILUNG |
发明人 |
BELLU, ROBERTO;SALVATI, PAOLO;STERPONE, BENITO |
分类号 |
H01L25/16;(IPC1-7):H01R9/26;H01H1/42 |
主分类号 |
H01L25/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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