Method of forming a penetration electrode and substrate having a penetration electrode

摘要

A method of forming a penetration electrode in which an electroconductive substance is inserted into a micropore (13) that has one end blocked off only by wiring and a pad formed by an electroconductive substance without the wiring and pad being broken. In this method of forming a penetration electrode, an electroconductive substance (14) is inserted into the micropore that penetrates a substrate and that has one aperture blocked off by an electroconductive thin film (12). After a protective member (20) that holds the electroconductive thin film is provided on a surface on the electroconductive thin film side of the substrate, an electroconductive substance is inserted from the other aperture of the micropore.