Probe finger structure and method for making a probe finger structure

摘要

A method for making a probe finger structure (14) including the steps of providing a wafer or wafer portion having an upper layer (32), a lower layer (30) and an insulating or etch stop layer (34) located between the upper and lower layers. The method further includes the step of etching the lower layer to form a mounting portion, and etching the upper layer to form a plurality of probe fingers. The method also includes the step of locating an electrically conductive material (40) on each of the probe fingers.