HIGH FREQUENCY IC PACKAGE, HIGH FREQUENCY UNIT USING IT, AND METHOD FOR MANUFACTURING THE SAME

摘要

A high frequency IC package and high frequency unit are simplified and downsized, and the number of manufacturing processes is reduced. The part 9 to determine a characteristic of the high frequency IC chip is arranged outside the sealing 14 of the high frequency IC package 5. The part can be arranged on the package board 7, circuit board 4 or housing chassis 1. When the part is arranged outside the sealing, the package and the high frequency unit 6 on which the package is mounted can be downsized. In the case of arranging the part on the circuit board, the part can be mounted together with other surface mounting parts. Therefore, the number of manufacturing processes can be reduced.