摘要 |
A MULTILAYER PRINTED WIRING BOARD IS COMPOSED OF A SUBSTRATE PROVIDED WITH THROUGH-HOLES, AND A WIRING BOARD FORMED ON THE SUBSTRATE THROUGH THE INTERPOSITION OF AN INTERLAMINAR INSULATING RESIN LAYER, THE THROUGH-HOLES HAVING A ROUGHENED INTERNAL SURFACE AND BEING FILLED WITH A FILLER(108), AN EXPOSED PART OF THE FILLER IN THE THROUGH-HOLES BEING COVERED WITH A THROUGH-HOLE- COVERING CONDUCTOR LAYER, AND A VIAHOLE FORMED JUST THEREABOVE BEING CONNECTED TO THE THROUGH-HOLE-COVERING CONDUCTOR LAYER. WITHOUT PEELING BETWEEN THE THROUGH-HOLE AND THE FILLER, THIS WIRING BOARD HAS A SATISFACTORY CONNECTION REABILITY BETWEEN THE THROUGH-HOLE AND THE INTERNAL LAYER CIRCUIT AND PROVIDES A HIGH DENSITY WIRING.(FIG. 1).
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