发明名称 MULTILAYER PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD, AND RESIN COMPOSITION FOR FILLING THROUGH-HOLE
摘要 A MULTILAYER PRINTED WIRING BOARD IS COMPOSED OF A SUBSTRATE PROVIDED WITH THROUGH-HOLES, AND A WIRING BOARD FORMED ON THE SUBSTRATE THROUGH THE INTERPOSITION OF AN INTERLAMINAR INSULATING RESIN LAYER, THE THROUGH-HOLES HAVING A ROUGHENED INTERNAL SURFACE AND BEING FILLED WITH A FILLER(108), AN EXPOSED PART OF THE FILLER IN THE THROUGH-HOLES BEING COVERED WITH A THROUGH-HOLE- COVERING CONDUCTOR LAYER, AND A VIAHOLE FORMED JUST THEREABOVE BEING CONNECTED TO THE THROUGH-HOLE-COVERING CONDUCTOR LAYER. WITHOUT PEELING BETWEEN THE THROUGH-HOLE AND THE FILLER, THIS WIRING BOARD HAS A SATISFACTORY CONNECTION REABILITY BETWEEN THE THROUGH-HOLE AND THE INTERNAL LAYER CIRCUIT AND PROVIDES A HIGH DENSITY WIRING.(FIG. 1).
申请公布号 KR20040053185(A) 申请公布日期 2004.06.23
申请号 KR20047005759 申请日期 1998.10.12
申请人 发明人
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
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