发明名称 High performance interconnect architecture for FPGAs
摘要 <p>A high performance interconnect architecture is described that provides reduced delay minimized electromigration and reduced area in FPGAs comprising a plurality of tiles consisting of interconnected logic blocks, that are separated by intervening logic blocks. Each set of interconnected logic blocks is linked by an interconnect segment that is routed in a straight line through an interconnect layer over intervening logic blocks and is selectively connected to the logic block at each end through a connecting segment.</p>
申请公布号 EP1432126(A2) 申请公布日期 2004.06.23
申请号 EP20030104727 申请日期 2003.12.16
申请人 STMICROELECTRONICS PVT. LTD. 发明人 BAL, ANKUR;KHANNA, NAMERITA
分类号 H03K19/177;(IPC1-7):H03K19/177 主分类号 H03K19/177
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