发明名称 MAGNETRON SPUTTERING SOURCE
摘要 At least two elongate targets (3) are arranged side by side with a gap which is substantially smaller than the width of the targets. Each of the targets is provided with its own electrical connection (5). Anodes (7) are preferably positioned between the targets. Independent claims are given for a coating chamber with the proposed magnetron sputtering source, a vacuum coating installation with such a coating chamber, a method for operating the coating installation, and an application of a magnetron sputtering source or a coating chamber or a coating installation covered by these claims.
申请公布号 KR20040053356(A) 申请公布日期 2004.06.23
申请号 KR20047007791 申请日期 1998.12.15
申请人 发明人
分类号 H01J37/34;H05H1/24;C23C14/08;C23C14/34;C23C14/35;H01L21/285 主分类号 H01J37/34
代理机构 代理人
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