| 发明名称 |
Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer |
| 摘要 |
A process and an apparatus are described for the treatment of wafers, in particular for the thinning of wafers. A wafer with a carrier layer and an interlayer arranged between the carrier layer and the wafer is also described, in which the interlayer is a plasmapolymeric layer that adheres to the wafer and adheres more strongly to the carrier layer than to the wafer. |
| 申请公布号 |
AU2003299296(A8) |
申请公布日期 |
2004.06.23 |
| 申请号 |
AU20030299296 |
申请日期 |
2003.11.28 |
| 申请人 |
FRAUNHOFER-GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG E.V.;JAKOB, ANDREAS |
发明人 |
VOLKMAR STENZEL;ANDREAS JAKOB;KLAUS-D. VISSING |
| 分类号 |
(IPC1-7):H01L21/68;C09J7/02;H01L21/56;H01L21/784;H01L21/304 |
主分类号 |
(IPC1-7):H01L21/68 |
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