| 摘要 |
A diode laser component is disclosed for providing a passive cooling heatsink with improved heat spreading such that a diode laser component which uses a heatsink of this type is constructed so as to be thermally symmetrical and compact and can be used for multiple purposes, particularly as regards beam control and electrical circuitry. The heatsink, which carries a diode laser bar on a mounting surface, contains an area for heat spreading which is enclosed by material and surrounds all edges of the mounting surface. Recesses for fastening of elements are arranged in the heatsink outside of the area for heat spreading.
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