发明名称 |
Resin-sealed semiconductor device |
摘要 |
A resin-sealed semiconductor device is provided which allows unwanted air to be bled out steadily and readily from the space defined between the resistor of a plate-like shape and the insulating substrate in the resin sealing step. The resin-sealed semiconductor device includes a resistor of a plate-like form anchored at both ends to the upper main surface of a substrate thereof. A space is provided between the resistor and the substrate. The primary components including the resistor mounted on the substrate are sealed with a curing resin material. In particular, the resistor has an aperture provided in a portion thereof, which is opposite to the substrate and defines the space with the substrate, for communication between the space and the upper side of the resistor.
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申请公布号 |
US6753578(B2) |
申请公布日期 |
2004.06.22 |
申请号 |
US20020209859 |
申请日期 |
2002.08.02 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
KANENARI TOSHIAKI;NAKAJIMA TOSHIHIRO |
分类号 |
H01L21/56;H01C1/014;H01C1/028;H01L23/31;(IPC1-7):H01L27/01 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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