Method for assembling integrated circuits with protection of the circuits against electrostatic discharge

摘要

A method and a circuit arrangement for protecting integrated circuits against electrostatic discharge (ESD) during and after packaging. An electrical connection between two integrated circuits is made by producing a low-impedance connection in the first integrated circuit, between a signal pad and a pad for a supply potential. The connection has a portion of reduced cross section, which is preferably severed by a current pulse applied after the arrangement has been assembled in a package and the connection has been electrically bonded to the second integrated circuit. The ESD protection during assembly requires no additional chip surface area.