发明名称 |
Conductive contamination reliability solution for assembling substrates |
摘要 |
A method and apparatus to eliminate conductive contamination reliability problems for assembled substrates, such as electrical arcing in power semiconductor leads. One embodiment of the invention involves a method for assembling an electrical component having leads on a substrate having conductive contacts, wherein an elastomer part encapsulates the leads of the electrical component. A second embodiment of the invention involves assembling an electrical component having leads to a substrate having conductive contacts, wherein an elastomer shape cut by a punch die encapsulates the leads of the electrical component. A third embodiment of the invention involves an assembled substrate including an electrical component having leads, and an elastomer surrounding the leads to encapsulate the leads. |
申请公布号 |
US6751857(B2) |
申请公布日期 |
2004.06.22 |
申请号 |
US20010824506 |
申请日期 |
2001.04.02 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
CHERNISKI ANDREW MICHAEL;KOCH JAMES KRISTIAN |
分类号 |
H01L23/495;H05K3/30;(IPC1-7):H05K3/32 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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