| 摘要 |
In one embodiment, the method far embossing a substrate, includes: heating a first substrate to a temperature above a glass transition temperature; preheating and maintaining a mold at a mold temperature below the glass transition temperature; introducing the heated substrate to the preheated mold; compressing the heated substrate in the mold; cooling the compressed substrate; and removing the cooled substrate from the mold. In another embodiment, the method for embossing a substrate, includes: heating a first substrate to a temperature above a substrate surface glass transition temperature; preheating a mold to a mold temperature of up to about 30� C. above the substrate surface glass transition temperature; introducing the heated substrate to the preheated mold; compressing the heated substrate in the mold; cooling the compressed substrate; and removing the cooled substrate from the mold. |
