Electronic equipment having insulating heat dissipation plate

摘要

Electronic equipment comprises a wiring board, an electronic component mounted on the wiring board and having a heat dissipation portion on a surface thereof, and an insulating heat dissipation plate thermally connected to the electronic component, wherein the heat dissipation portion is directly connected to the heat dissipation plate via a heat conductive bonding material that includes metal. The heat dissipation plate is a ceramic plate having at least one land for connecting the electronic component thereto, or a resin plate containing highly heat conductive material. By directly connecting the insulating heat dissipation plate to an electronic component generating heat, an insulating plate between the heat dissipation plate and the electronic component is not required.