发明名称 |
Semiconductor device-socket having rotationally movable heat sinks |
摘要 |
A semiconductor device socket having one or more heat sinks for dissipating heat from the object under test. The one or more heat sinks are held by arm members disposed in the semiconductor device socket for providing rotational movement about the object under test accommodation portion.
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申请公布号 |
US6752645(B2) |
申请公布日期 |
2004.06.22 |
申请号 |
US20020212875 |
申请日期 |
2002.08.07 |
申请人 |
YAMAICHI ELECTRONICS CO., LTD. |
发明人 |
NAKAMURA YUJI;KUDO YUKI |
分类号 |
H01R33/76;H01L23/36;H01L23/40;(IPC1-7):H01R13/62;G01R31/02;H05K7/20 |
主分类号 |
H01R33/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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