发明名称 Methods for fabricating semiconductor devices having capacitors
摘要 Methods for fabricating semiconductor devices having capacitors are provided. A plurality of storage node electrodes are formed on a semiconductor substrate. Then, a capacitor dielectric layer is formed over the storage node electrodes. A plate electrode layer is subsequently formed on the capacitor dielectric layer. A hard mask layer is then formed on the resultant structure where the plate electrode layer is formed so as to fill a gap between the adjacent storage node electrodes. The hard mask layer and the plate electrode layer are successively patterned to form a plate electrode.
申请公布号 US6753221(B2) 申请公布日期 2004.06.22
申请号 US20020322274 申请日期 2002.12.17
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JEON JEONG-SIC;KANG CHANG-JIN;SON SEUNG-YOUNG;KIM JIN-HONG
分类号 H01L27/108;H01L21/02;H01L21/311;H01L21/3213;H01L21/8242;(IPC1-7):H01L21/824 主分类号 H01L27/108
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