| 摘要 |
A method and apparatus for conditioning a fixed-abrasive polishing pad used in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a conditioning member having a smooth surface. The method includes providing a conditioning member having a smooth surface, pressing the conditioning member against the fixed-abrasive polishing pad, and moving the fixed-abrasive polishing pad. In one embodiment, the method further comprises moving the conditioning member perpendicular to the direction of movement of the fixed-abrasive pad to compensate for variations in amounts of exposed abrasive on the fixed-abrasive pad.
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