发明名称 |
SEMICONDUCTOR DEVICE HAVING A THERMOSET-CONTAINING DIELECTRIC MATERIAL AND METHODS FOR FABRICATING SAME |
摘要 |
<p>A semiconductor device having a thermoset-containing, dielectric material and methods for fabricating the same is provided. The device may take the form of a printed circuit board, an integrated circuit chip carrier, or the like. The dielectric material is a non-fibrillated, fluoropolymer matrix that has inorganic particles distributed therein and is impregnated with a thermoset material.</p> |
申请公布号 |
SG104260(A1) |
申请公布日期 |
2004.06.21 |
申请号 |
SG20000003378 |
申请日期 |
2000.06.15 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DONALD S. FARQUHAR;KONSTANTINOS I. PAPATHOMAS;MARK D. POLIKS |
分类号 |
B32B15/082;C08K3/00;C08L27/12;C08L101/00;H01L23/14;H05K1/02;H05K1/03;H05K3/38;(IPC1-7):H05K1/03 |
主分类号 |
B32B15/082 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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