| 摘要 |
PURPOSE: A ceramic package is provided to improve an attenuation characteristic of a filter stopband by guaranteeing a minimum path between a lead and a ground electrode of a foot pad through a castillation of a ceramic package used in an SAW(surface acoustic waves) duplexer or an FBAR(film bulk acoustic resonator) duplexer. CONSTITUTION: A lower ground pattern of a strip line, a ground terminal and a signal terminal are formed in a foot pad(10). The first dielectric layer having a signal pattern(61) of the strip line in its upper portion is formed on the foot pad. The second dielectric layer having an upper ground pattern of the strip line in its upper portion is formed on the first dielectric layer. A chip(30) is attached to the upper portion on the upper ground pattern formed in the upper portion of the second dielectric layer. A signal junction pad(40) is connected to a wire to transmit the signal of the chip. A single layer(81) for forming the single junction pad on a ceramic body(80) is formed as an inner part of the ceramic body. The center of the single layer is cut by a predetermined portion to form a receiving hole(82) for receiving the chip. A lead(50) on the ceramic body is encapsulated to protect the chip. The castillation(90) directly connects an electrode pattern on the uppermost end of the ceramic body connected to the lead with an electrode pattern on the foot pad. |
