ETCHING SOLUTION CAPABLE OF REMOVING MOLYBDENUM DEBRIS FROM COPPER MOLYBDENUM LAYER AND ETCHING METHOD THEREOF

摘要

PURPOSE: An etching solution capable of removing molybdenum debris from a copper molybdenum layer and an etching method thereof are provided to easily control etching rate, improve tape profile, enhance the linearity of a pattern, constantly conserve the same etching characteristics, and increase the maintenance time of the etching solution. CONSTITUTION: An etching solution of a copper molybdenum layer contains a hydrogen peroxide solution of 5-30 weight%, organic acid of 0.5-5 weight%, and phosphate salt of 0.2-5 weight%. The etching solution further includes the first addictive of 0.2-5 weight%, the second addictive of 0.2-5 weight%, a fluorine compound of 0.01-1.0 weight% and deionized water.