METHOD OF FORMING 3-DIMENSIONAL STRUCTURE ON WAFER WITH UNIFORMLY COATED RESIST

摘要

PURPOSE: A method is provided to coat uniformly a resist layer on a wafer with a 3-dimensional structure by immersing only an active side of the wafer in predetermined resist and applying a voltage between the wafer and the resist. CONSTITUTION: Each of 3-dimensional structures is electrically connected to a bonding pad of a wafer(1) through an interconnection. Electrophoretic resist(5) is used as photoresist. A resist coating layer is formed on the wafer with 3-dimensional structures by immersing an active side of the wafer in the electrophoretic resist and applying a voltage between the wafer and the electrophoretic resist.