发明名称 |
SEMICONDUCTOR DEVICE HAVING A BOND PAD AND METHOD FOR ITS FABRICATION |
摘要 |
A bond pad ( 200 ) has a first wire bond region ( 202 ) and a second wire bond region ( 204 ). In one embodiment, the first wire bond region ( 202 ) extends over a passivation layer ( 18 ). In an alternate embodiment, a bond pad ( 300 ) has a probe region ( 302 ), a first wire bond region ( 304 ), and a second wire bond region ( 306 ). In one embodiment, the probe region ( 302 ) and the wire bond region ( 304 ) extend over a passivation layer ( 18 ). The bond pads may have any number of wire bond and probe regions and in any configuration. The ability for the bond pads to have multiple wire bond regions allows for multiple wire connections to a single bond pad, such as in multi-chip packages. The ability for the bond pads to extend over the passivation layer also allows for reduced integrated circuit die area. |
申请公布号 |
AU2003291472(A1) |
申请公布日期 |
2004.06.18 |
申请号 |
AU20030291472 |
申请日期 |
2003.11.12 |
申请人 |
MOTOROLA, INC., A CORPORATION OF THE STATE OF DELAWARE |
发明人 |
SUSAN H. DOWNEY;PETER R. HARPER;KEVIN HESS;MICHAEL, V. LEONI;TU-ANH TRAN |
分类号 |
H01L21/66;H01L21/60;H01L23/485;H01L23/58;H01L25/065 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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