CRACK RESISTANT INTERCONNECT MODULE

摘要

An interconnect module providing conductive interconnection paths between an integrated chip, a printed wiring board, and at least one layer within the module, incorporating a plurality of alternating dielectric and conductive layers laminated together to form a unitary structure. The module includes a chip attach surface and a board attach surface, that define contact pads for attachment to corresponding pads on the chip and printed wiring board, respectively, by means of solder balls.