发明名称 EPOXY RESIN COMPOSITION AND VACUUM EQUIPMENT USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition which has a small gas-releasing rate in a vacuum atmosphere, and to provide a vacuum equipment using the same. SOLUTION: This epoxy resin composition is characterized in that at least a vacuum atmosphere-contacting surface is formed from a composition prepared by adding a thermoplastic resin to a mixture of a catalyst or a curing agent with an epoxy resin having two or more epoxy groups in the chemical structure. A reactive epoxy resin having one or more epoxy groups in the chemical structure is preferably contained as a diluent. The epoxy resin composition is used on the surface of vacuum equipment contacting with vacuum atmosphere. The epoxy resin composition may be applied by a coating method such as a coating method, a two layer casting method, a gel coating method, a powder coating method or a prepreg adhering method. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004168829(A) 申请公布日期 2004.06.17
申请号 JP20020333684 申请日期 2002.11.18
申请人 YASKAWA ELECTRIC CORP 发明人 HAMAO SATOKAZU
分类号 B32B27/38;C08K5/1515;C08L63/00;C08L71/02;C08L101/00;(IPC1-7):C08L63/00;C08K5/151 主分类号 B32B27/38
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