发明名称 Dielectric film, its formation method, semiconductor device using the dielectric film and its production method
摘要 A high-quality dielectric film is formed by generating plasma of a high electron density by a method such as diluting a rare gas or raising a frequency of a power supplier, and generating oxygen atoms or nitrogen atoms of a high density. The dielectric film contains silicon oxide in which the composition ratio of silicon and oxygen is between (1:1.94) and (1:2) both inclusive, silicon nitride in which the composition ratio of silicon and nitrogen is between (1:1.94) and (1:2) both inclusive, or silicon oxynitride in which the composition ratio of silicon and nitrogen is between (3:3.84) and (3:4) both inclusive.
申请公布号 US2004113227(A1) 申请公布日期 2004.06.17
申请号 US20030726870 申请日期 2003.12.02
申请人 GOTO MASASHI;NAKATA YUKIHIKO;AZUMA KAZUFUMI;OKAMOTO TETSUYA 发明人 GOTO MASASHI;NAKATA YUKIHIKO;AZUMA KAZUFUMI;OKAMOTO TETSUYA
分类号 H01L21/31;H01L21/316;H01L21/318;H01L21/336;H01L29/786;(IPC1-7):H01L29/00 主分类号 H01L21/31
代理机构 代理人
主权项
地址