发明名称 Semiconductor device and method of manufacturing the same
摘要 The present invention provides a semiconductor device wherein the area of a peripheral circuit region with respect to a pixel region is reduced, and provides a manufacturing method of the semiconductor device. A semiconductor device according to the present invention is characterized by having a pixel region 1, peripheral circuit regions 2a to 2c arranged in at least a part of the periphery of the pixel region, and a wiring formed in the peripheral circuit region, and by having a wiring multilayered with two or more layers. At least one layer of the multilyered wiring is formed from a low resistance material. Transistors are formed in the peripheral circuit region, and the multilayer wiring with two or more layers is formed on the upper side of the transistors.
申请公布号 US2004113142(A1) 申请公布日期 2004.06.17
申请号 US20030717562 申请日期 2003.11.21
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD.;SHARP KABUSHIKI KAISHA 发明人 ISHIKAWA AKIRA;FUKUSHIMA YASUMORI
分类号 G02F1/1368;G02F1/1345;G02F1/1362;H01L21/3205;H01L21/768;H01L21/77;H01L21/84;H01L23/52;H01L27/12;H01L29/786;(IPC1-7):H01L29/06;H01L31/032 主分类号 G02F1/1368
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