| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component soldering device to a substrate for automatically soldering an electronic component to a circuit of the substrate in the form of a spot. SOLUTION: The device is provided with a fluxer 20, a preheater 30, a solder jet nozzle 40 and a substrate transfer means 60. The device is also provided with a sequence control means 90 which blows flux on an electronic component soldered part of the substrate from the fluxer 20, preliminarily heats the electronic component soldered part of the substrate by the preheater 30, and applies molten solder which is jetted from the solder jet nozzle 40 to the electronic component soldered part of the substrate 50 when the substrate transfer means 60 sequentially transfers the substrate 50 to a vicinity of the fluxer 20, that of the preheater 30 and that of the solder jet nozzle 40. The substrate transfer means 60 is provided with a rocking means 80 for detaching the substrate where molten solder is applied to the electronic component soldered part from the solder jet nozzle 40 while it is rocked forward/backward. COPYRIGHT: (C)2004,JPO |
