| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealing apparatus and a resin sealing method for realizing reliable attraction of a film to the internal surface of the sealing cavity, realization of simplification and low cost of metal die structure and reduction of load required for design change. SOLUTION: In the resin sealing apparatus 120, a film 107 is provided between the side of sealing cavity surface 101A of an upper die 110 or lower die 116 of a metal die 118 and the resin to be sealed, and the film 107 is sucked to the sealing cavity surface 101A with an sucking means at the time of sealing with resin the lead frames or the like within the sealing cavity 101 of the metal die 118. An sucking hole 106 of the sucking means is provided at the portion located in the outside of the sealing cavity 101 and communicated therewith. COPYRIGHT: (C)2004,JPO |
