| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring method forming fine wiring by attaching scattered particles through a mask immediately after activation of a surface of an organic material substrate, and to provide wiring, the substrate and a device. SOLUTION: When a target material 5 is irradiated with a laser beam, plasma at a high temperature is formed and a vacuum ultraviolet ray is generated. It is exposed to a surface of a resin substrate S through the mask 6 and is activated. Neutral atoms, ions, clusters and the like are formed on a surface of the target material 5 where plasma is formed. The particles are scattered at high speed of a sonic level. The surface of the resin substrate S is activated through the mask 6 by exposure of the vacuum ultraviolet ray, and the scattered particles adhere to the substrate through the mask 6 immediately after. Consequently, the particles firmly stuck to the surface of the resin substrate S and wiring in the desired shape is formed. COPYRIGHT: (C)2004,JPO
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