发明名称 COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cooling device for an electronic apparatus with a heating element to be cooled by circulating cooling medium liquid in a flow path, having improved reliability and reduced thickness without lowering its airtightness during reopening for the maintenance of a sealing member for the cooling medium liquid. SOLUTION: The cooling device comprises the sealing member for sealing the cooling medium liquid. The sealing member consists of a first sealing member formed of a soft material to be inserted into a sealing hole for the cooling medium liquid and a second sealing member formed of a hard material to be inserted into the first sealing member. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004169986(A) 申请公布日期 2004.06.17
申请号 JP20020335930 申请日期 2002.11.20
申请人 HITACHI LTD;HITACHI CABLE LTD 发明人 NEHO YASUSHI;MINAMITANI RINTARO;NAGATA TATSUYA;OSANAWA TAKASHI;SUZUKI ATSUSHI;HOTTA DAICHI;SAKAYORI KAZUSHI
分类号 F25D17/02;(IPC1-7):F25D17/02 主分类号 F25D17/02
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