| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper electroplating bath including one or more inhibitor compounds capable of supplying openings of sizes below microns which do not contain pits or gaps and are packed with copper in manufacturing electronic devices, for example, printed wiring boards and integrated circuits. SOLUTION: The copper electroplating bath contains one or more copper ion sources, electrolyte, and one or more poly(alkylene oxide) random copolymers including two or more alkylene oxide monomers as polymerization units. COPYRIGHT: (C)2004,JPO
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