发明名称 POROUS ORGANIC FILM-FORMING COMPOSITION, POROUS ORGANIC FILM-FORMING METHOD AND POROUS ORGANIC INSULATING FILM
摘要 PROBLEM TO BE SOLVED: To provide a porous organic film-forming composition capable of producing an insulating film having a low dielectric constant, to provide a method for forming the insulating film having the low dielectric constant, and to provide the insulating film having the low dielectric constant. SOLUTION: This porous organic film-forming composition contains (A) an aromatic polymer having units expressed by the formula (Ar<SP>1</SP>is a residue having an aromatic ring; X and Z are each a direct bond, a bivalent saturated hydrocarbon residue, -CR<SP>1</SP>=CR<SP>2</SP>-, -C≡C-, a bivalent residue having an aromatic ring, a bivalent residue having an alicyclic hydrocarbon ring, -O-, -CO-, -COO-, -S-, -SO- or -SO<SB>2</SB>-; and Y is a bivalent saturated hydrocarbon residue, -CR<SP>3</SP>=CR<SP>4</SP>-, -C≡C-, a bivalent residue having an aromatic ring or a bivalent residue having an alicyclic hydrocarbon ring) or a monomer having at least two -C≡C- residues in its molecule and (B) a thermally vaporizing compound and/or a thermally decomposing polymer. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004169012(A) 申请公布日期 2004.06.17
申请号 JP20030367049 申请日期 2003.10.28
申请人 SUMITOMO CHEM CO LTD 发明人 SATO HISAYA;YOKOTA AKIRA
分类号 C08J9/26;C07C43/285;C07F7/08;C08L87/00;H01L21/312;H01L21/768;H01L23/522;(IPC1-7):C08L87/00 主分类号 C08J9/26
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