| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve heat dissipating property and enhance mountability for constructing an optical module by mounting an optical semiconductor device in a mounting substrate. <P>SOLUTION: An electrode is arranged on only a back surface of a package, and a bear chip is directly adhered to the electrode. Thereby, the heat dissipating property is enhanced. Moreover, a lower portion of a convex lens is shaped into a rectangular parallelepiped in which the lower portion can be easily held. <P>COPYRIGHT: (C)2004,JPO |
