| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which is capable of setting a reflow distance L at a desired value with high accuracy. SOLUTION: Gas introduced into a chamber 101 is blowed on a substrate 1 as it passes through openings 211 bored in a gas blow-off board 21 formed of a curved board that is convex or concave to the substrate 1. The gas is blowed on the substrate 1 uniformly through the gas blow-off board 21, so that the reflow distance L can be controlled with high accuracy through all the surface of the substrate 1. COPYRIGHT: (C)2004,JPO
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