发明名称 METHOD AND DEVICE FOR CONTROLLING CHILLER FOR TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To effectively save energy in a treatment system by accurately controlling the refrigerant supply operation of a chiller according to the operating conditions of a treatment apparatus. SOLUTION: When it is detected beforehand that a plasma etching device 10 is brought into a rest state for a specified threshold time Ts or longer, i.e., in an idle state as a result that a host computer 16 reads process sequence recipe information on each treated substrate W beforehand, a controller 14 transmits signals for instructing an energy saving mode to a chiller unit 12 according to a notice from the host computer 16. In the chiller unit 12, the flow rate of refrigerant CW1 supplied to the etching device 10 from a first flow rate N1 for normal mode to a second flow rate N2 for the energy saving mode. Thus, during the energy saving mode, each part in the chiller unit 12 is operated with a low output, and the power consumption of all of pumps 56 and 68 and inverters 58 and 66 is lowered to a rather low level. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004169933(A) 申请公布日期 2004.06.17
申请号 JP20020332800 申请日期 2002.11.15
申请人 TOKYO ELECTRON LTD 发明人 SASAKI NORIKAZU
分类号 F25D17/02;H01L21/3065;(IPC1-7):F25D17/02;H01L21/306 主分类号 F25D17/02
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