POLYAMIDE-IMIDE, THERMOSETTING RESIN COMPOSITION, AND METHOD FOR PRODUCING POLYAMIDE-IMIDE

摘要

PROBLEM TO BE SOLVED: To provide a polyamide-imide which has a high molecular weight and can constitute a thermosetting resin composition curable into a product excellent in heat resistance and modulus and high in adhesion to a metal foil. SOLUTION: The polyamide-imide is obtained by reacting a diimidedicarboxylic acid obtained by reacting a diamine mixture containing p-phenylenediamine and m-phenylenediamine with trimellitic anhydride with an aromatic diisocyanate. COPYRIGHT: (C)2004,JPO