发明名称 METHOD FOR CUTTING GLASS SUBSTRATE MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a method for cutting a glass substrate material, by which the glass substrate material is also cut while forming a marking line with "a scriber", the formation of chipping or the like is almost suppressed, and a cut surface having a good quality can be obtained. SOLUTION: The method for cutting the glass substrate material includes a removing process for removing a part or whole of the rear surface of the glass substrate material and a scribing process for forming the ruled line which causes a crack reaching the rear surface of the glass substrate material. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004168584(A) 申请公布日期 2004.06.17
申请号 JP20020335293 申请日期 2002.11.19
申请人 THK CO LTD;BELDEX CORP 发明人 ISHIKAWA YUICHI;HAYASHI TOSHIO
分类号 G02F1/1333;C03B33/023;C03B33/037;C03B33/04;C03B33/07;C03C15/00;G09F9/30;H01L51/50;H05B33/02;(IPC1-7):C03B33/037;G02F1/133;H05B33/14 主分类号 G02F1/1333
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