发明名称 PACKAGING APPARATUS AND ASSEMBLING METHOD FOR THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a packaging apparatus capable of withstanding loading weight and vibration/drop impact applied during distribution. SOLUTION: The packaging apparatus comprises a box with an open top, in which a package is housed, and buffer members, which are placed at the bottom of either one pair of opposite side walls of the box, respectively, to support the package in the box. Each buffer material has a honeycomb construction comprising upper and lower paperboards between which almost vertical hollow cell walls are formed, and each buffer material is arranged to make the hollow cell wall surfaces almost perpendicular to the bottom of the box. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004168328(A) 申请公布日期 2004.06.17
申请号 JP20020333517 申请日期 2002.11.18
申请人 MITSUBISHI ELECTRIC CORP 发明人 UNNO KENICHI;NAGANO MASAO;MOCHIZUKI TATSUYA;IWASAKI HIROSHI;MAEZAWA HIDEKAZU
分类号 B65D85/68;B65D5/50;B65D81/113;(IPC1-7):B65D81/113 主分类号 B65D85/68
代理机构 代理人
主权项
地址