发明名称 Binder resin solution composition, coatings, inks, adhesives and primers
摘要 The present invention provides a binder resin solution composition, and a coating, ink, and adhesive containing the composition as an active ingredient, the binder resin solution composition having a solid content of 10 to 50 wt. % and comprising (a) a chlorinated polyolefin prepared by chlorinating to a chlorine content of 10 to 40 wt. % an ethylene-propylene-butene ternary random copolymer having an ethylene content of 3.0 to 3.7 mol %, 1-butene content of 2.4 to 2.8 mol %, and melting point of 129 to 133° C., and (b) an organic solvent.
申请公布号 US2004116590(A1) 申请公布日期 2004.06.17
申请号 US20030482053 申请日期 2003.12.29
申请人 KASHIHARA KENJI;NISHIOKA TETSUJI;TSUNEKA TATSUO;MAEKAWA SHOJI;WADA ISAO 发明人 KASHIHARA KENJI;NISHIOKA TETSUJI;TSUNEKA TATSUO;MAEKAWA SHOJI;WADA ISAO
分类号 C09D5/00;C08F8/20;C08F8/46;C08F210/06;C08F255/02;C08L23/14;C08L51/06;C09D11/00;C09D11/10;C09D123/28;C09D151/06;C09J123/28;C09J151/06;(IPC1-7):C08L23/00 主分类号 C09D5/00
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