发明名称 High-frequency module
摘要 It is an object of the present invention to provide a high-frequency module whose production yield as a complete module can be prevented from being lowered. The high-frequency module according to the present invention includes a main module including a first high-frequency circuit at least a part of which is constituted by a conductive pattern built in a multi-layered substrate and a sub-module including a second high-frequency circuit, and the sub-module is inserted into a cavity formed in the main module. According to the present invention, the main module including the first high-frequency circuit and the sub-module including the second high-frequency circuit are constituted as separate components and the main module and the sub-module are integrated by inserting the sub-module into the cavity formed in the main module. Therefore, it is possible to use only a main module and sub-module that have been inspected after manufacture and found to be non-defective. Accordingly, it is possible to markedly increase the yield of the high-frequency module as a whole.
申请公布号 US2004113719(A1) 申请公布日期 2004.06.17
申请号 US20030473019 申请日期 2003.09.25
申请人 NAKAI SHINYA;YAMASHITA YOSHINARI;NINOMIYA HIDEAKI 发明人 NAKAI SHINYA;YAMASHITA YOSHINARI;NINOMIYA HIDEAKI
分类号 H05K1/14;H01L23/13;H01L23/498;H01L23/552;H01L23/66;H03B5/18;H03H9/72;H04B1/40;H04B1/48;H05K1/02;H05K1/03;H05K1/18;H05K3/46;(IPC1-7):H03H9/70 主分类号 H05K1/14
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