| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can reduce the costs and can be miniaturized, and its manufacturing method. <P>SOLUTION: The manufacture of the semiconductor device comprises a step of preparing a mounting substrate 10 having a first substrate, a first connecting pad 21 formed on the first substrate, and a second connecting pad 22 formed on the first substrate; a step of preparing an auxiliary substrate 40 having a second substrate, a first bump 41 formed on the second substrate, a wiring pattern 43 formed on the second substrate and connected to the first bump 41, and a second bump 42 formed on the second substrate and connected to the wiring pattern 43; and a step of connecting the first connecting pad and the second bump and connecting the second connecting pad and the second bump by contacting the first connecting pad and the second bump, contacting, heating and pressurizing the second connecting pad and the second bump. <P>COPYRIGHT: (C)2004,JPO |
